PECVD Coating Equipment_MV-LH06K
A set of inline quasi dynamic PECVD coating equipment, depositing I layer & nanocrystalline silicon film on front & backside of wafer.
Equipment Advantages
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01Inline multi chamber quasi dynamic PECVD coating technique
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02Layered high quality nanocrystalline silicon passivation coating technology
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03PECVD multilayer showerhead discharge cathode design
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04Composite tray design with large size, light load, low thermal expansion coefficient and high flatness
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05Inline corrosion resistant magnetic fluid & vacuum transfer for large size tray
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06RF rapid ignition setup and real-time plasma glow observation position
Equipment Picture

Basic Parameters
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1. Throughput(pcs/hour) and Wafer Size*: 17280pcs@G12, half-cell; 19400pcs@G12R, half-cell