Texturing and Cleaning Equipment_HJ-TEX-182/210
In this equipment, the surface of silicon wafer is etched into pyramid texture structure with acid and alkali liquid, and then cleaned and dried.
Equipment Advantages
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01Compatible with large-size, thinned, and half-cut wafers
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02Large capacity and full customization
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03Excellent process controllability with 'Feed and Bleed Mode'
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04Strict internal environment control (acid-alkali isolation, FFU, static electricity elimination, etc.)
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05Complete data collection (lot log, ID tracking, recording curve, etc.)
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06
Equipment Picture
Basic Parameters
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1. Throughput(pcs/hour) and Wafer Size*: 22000pcs@G12, half-cell ; 32000pcs@G12R, half-cell