Substrate Dicing and Sorting Equipment (Jig Saw)
This equipment is applied to the dicing of finished substrate frame products in CSP (Chip Size Package) packaging form, incorporating process units such as automatic loading/unloading, conveying and positioning, alignment and dicing, knife mark detection, cleaning and drying, optical inspection, and sorting.
It offers a wide range of functional options, is suitable for various products, and can meet the customized needs of different customers. It has advantages including high processing precision, high production efficiency, an intelligent operating system, and easy equipment maintenance.
It offers a wide range of functional options, is suitable for various products, and can meet the customized needs of different customers. It has advantages including high processing precision, high production efficiency, an intelligent operating system, and easy equipment maintenance.
Equipment Advantages
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01Excellent vibration suppression platform structure, enabling stable and efficient processing technology
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03Independently developed spindle with core technologies
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04Independently developed Blade Breakage Detection (BBD) and Non-Contact Sensing (NCS) systems; 5.Dual cutting axes and dual cutting disc stations
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05Dual cutting axes and dual cutting disc stations
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06Independently developed visual inspection software to screen different types of defective products
Equipment Picture
Basic Parameters
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1. Applicable Products：Dicing of finished products such as QFN, BGA, and LGA with substrate frame sizes ranging from 189×68mm to 280×140mm