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Suzhou Maxwell Technologies Co., Ltd.
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IGBT Wafer Grinding Equipment
This equipment is used for the thinning process of 12-inch power device products.
Equipment Advantages
  • 01
    High-precision castings with no stress creep
  • 02
    Equipped with a contact module (a non-contact module can also be installed) to stably control the wafer thickness
  • 03
    Equipped with an independently developed air bearing table to enhance grinding stability
  • 04
    Excellent visual inspection and positioning system, capable of identifying the front and back sides of wafers and performing automatic positioning compensation
  • 05
    Advanced visual interface, which can monitor and display curves of key processing information in real time, such as spindle current and torque
  • 06
    The operating software is simple and user-friendly, and the equipment is easy to maintain
Equipment Picture
IGBT Wafer Grinding Equipment
Basic Parameters
  • 1. Applicable Products：12-inch semiconductor power devices