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Suzhou Maxwell Technologies Co., Ltd.
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12-inch Grinding and Polishing Integrated Equipment
This equipment is used for the thinning and polishing processes of 8-inch and 12-inch semiconductor wafers.
Equipment Advantages
  • 01
    High-precision castings with no stress creep; self-developed spindle with high stability; Equipped with contact and non-contact height measurement modules to stably control wafer thickness
  • 02
    Combined with independently developed spindles and polishing wheels, it realizes the wafer dry polishing function
  • 03
    Improves the grinding residual damage layer and further enhances wafer strength
  • 04
    Excellent visual inspection and positioning system, capable of identifying the front and back sides of wafers and realizing automatic positioning compensation
  • 05
    Independent table tilt motor adjustment and control, with high precision and easy operation
  • 06
    Advanced visual interface, which can display and monitor curves of key processing information in real time
Equipment Picture
12-inch Grinding and Polishing Integrated Equipment
Basic Parameters
  • 1. Applicable Products: 8/12-inch silicon wafers
  • 2. Thinnest Product Compatible: ≥50μm (DBG process: ≥25μm)
  • 3. Grinding Speed: 0.01μm/s~80μm/s
  • 4. Applicable Material Thickness: ≤1.8mm
  • 5. Processing Quality: TTV ≤2.5μm，WTW±2.5μm; Ra≤0.005μm