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Suzhou Maxwell Technologies Co., Ltd.
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12-inch Wafer Grinding Equipment
This equipment is used for the thinning process of 8/12-inch semiconductor wafers.
Equipment Advantages
  • 01
    High-precision castings with no stress creep; self-developed spindle with high stability
  • 02
    By combining with independently developed high-mesh grinding wheels, it realizes wafer precision polishing function, enhances wafer strength, and reduces the thickness of the surface damage layer
  • 03
    Excellent visual inspection and positioning system, capable of identifying the front and back sides of wafers, realizing automatic positioning compensation, and ensuring high-precision positioning
  • 04
    Table tilt motor adjustment and control, featuring high precision and easy operation
  • 05
    Advanced visual interface, which can display and monitor curves of key processing information in real time
  • 06
Equipment Picture
12-inch Wafer Grinding Equipment
Basic Parameters
  • 1. Applicable Products：8/12-inch semiconductor wafers