简 | EN |
Suzhou Maxwell Technologies Co., Ltd.
简 | EN
Solar+
Display+
Semiconductor+
Customer Service+
8-inch Wafer Grinding Equipment
This equipment is used for the thinning process of 4/6/8-inch semiconductor wafers.
Equipment Advantages
  • 01
    Material information scanning and input, with a Fab-level wafer handling arm
  • 02
    Dual high-rigidity air bearing spindle design, combined with independently developed high-mesh grinding wheels, to achieve wafer thinning function
  • 03
    Excellent visual inspection and positioning system, capable of identifying the front and back sides of wafers, realizing automatic positioning compensation, and ensuring high-precision positioning
  • 04
    Water-sealed vacuum pump, featuring stable vacuum and low vibration
  • 05
    Fully independently designed equipment software with visual operation management, which can display and monitor key processing information in real time
  • 06
    Customized ultra-high-precision processing station with excellent performance and low vibration
Equipment Picture
8-inch Wafer Grinding Equipment
Basic Parameters
  • 1. Applicable Products: 4/6/8-inch semiconductor wafers
  • 2. Final Product Thickness: 100μm
  • 3. Grinding Speed: 0.01μm/s~50μm/s
  • 4. Applicable Material Thickness: ≤1.8mm
  • 5. Processing Quality: TTV ≤2.5μm，WTW±2.5μm; Ra≤0.08μm