Wafer Edge Profiling Equipment
This equipment is used for edge trimming processing in the stacking process, reducing chipping and cracking in the wafer thinning process.
Equipment Advantages
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01Stable processing：Vibration suppression gantry structure platform + precision motion system
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02Clean production：Edge-clamped wafer handling
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03Graphical interface and real-time process parameter monitoring
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Equipment Picture
Basic Parameters
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1. Applicable Products：CIS, 3D NAND, DRAM, Micro LED, etc.