12-inch Wafer Laser Grooving Equipment
This equipment uses lasers to groove the wafer surface. Its user-friendly operation design enhances user experience, while the intelligent software system improves production efficiency.
Equipment Advantages
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01Equipped with high-precision linear motors and a high-speed X-Y motion platform
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02Adopts specially customized laser processing, ensuring high-quality cutting grooves with minimal thermal impact
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03Simple software operation and convenient equipment maintenance
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04A single focal point enables free combination of wide and fine laser modes, achieving high processing precision
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05Uses a backlit cutting stage for better edge recognition performance
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Equipment Picture
Basic Parameters
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1. Applicable Products: 8~12 inch Low-K/CMOS and other semiconductor wafers
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2. Light Source: UV nanosecond or short-pulse customized laser
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3. Grooving Depth: ≥10μm
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4. Cutting Speed：0-1000mm/s
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5. Operation Mode：Fully automatic
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6. Adaptive Cutting Width：30-90μm