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Suzhou Maxwell Technologies Co., Ltd.
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8-inch SiC Wafer Grinding Equipment
This equipment is used for the thinning processing of 4/6/8-inch hard material wafers.
Equipment Advantages
  • 01
    High-precision castings with no stress creep; self-developed spindle with high stability
  • 02
    Equipped with a contact height measurement module and a closed-loop control system
  • 03
    Combined with independently developed high-mesh grinding wheels, it realizes wafer precision polishing function, reduces surface damage, and ensures wafer quality
  • 04
    Excellent visual inspection and positioning system, capable of identifying the front and back sides of wafers and realizing automatic positioning compensation
  • 05
    Table tilt motor adjustment and control, with high precision and easy operation
  • 06
    Advanced visual interface, which can display and monitor curves of key processing information in real time
Equipment Picture
8-inch SiC Wafer Grinding Equipment
Basic Parameters
  • 1. Applicable Products：4/6/8-inch hard materials such as silicon carbide and sapphire