Frame Handling Laser Stealth Dicing Equipment
This equipment is used for internal modification and cutting processes of silicon wafers and third-generation semiconductors such as silicon carbide and gallium nitride. Its advanced intelligent system ensures the quality and efficiency of product processing.
Equipment Advantages
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01Equipped with a high-precision wafer surface height tracking and compensation system, it adopts a fast-stepping movement mode.
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02Equipped with light spot shaping and compensation functions, it uses SLM technology for laser modulation. Through phase compensation, the laser is more focused, enhancing processing efficiency and quality
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Equipment Picture
Basic Parameters
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1. Applicable Products: 4~12 inch silicon wafers and third-generation semiconductors such as silicon carbide and gallium nitride
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2. Laser Source: Customized high-precision, high-stability infrared laser
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3. Cutting Speed: 0-1000mm/s
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4. Operation Mode: Fully automatic