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Suzhou Maxwell Technologies Co., Ltd.
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12-inch Wafer Dicing Saw
This equipment is mainly used for fully automatic dicing processing of 8-inch and 12-inch semiconductor wafers. It offers a wide range of functional options, is suitable for various products, and can meet the customized needs of different customers. It boasts advantages such as high processing precision, high production efficiency, intelligent operating system, and easy equipment maintenance.
Equipment Advantages
  • 01
    Vibration suppression platform structure design ensures stable processing quality requirements
  • 02
    High-precision ball screws, linear guides, and high-performance grating scale closed-loop control achieve high precision of equipment performance and minimal temperature impact
  • 03
    Independently developed Blade Breakage Detection (BBD) system, using GPU + neural network architecture to achieve smaller notch detection
  • 04
    Independently developed Non-Contact Sensing (NCS) system with height measurement stability of 3σ < ±3μm
  • 05
    High-performance control system with a graphical software interface, capable of real-time display of key process parameter curves
  • 06
    Automatic loading/unloading, conveying and positioning, alignment and cutting, knife mark detection, cleaning and drying, realizing a fully automatic operation mode
Equipment Picture
12-inch Wafer Dicing Saw
Basic Parameters
  • 1. Applicable Products: 8~12 inch semiconductor wafers