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Suzhou Maxwell Technologies Co., Ltd.
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Wafer Handling Laser Stealth Dicing Equipment
This equipment is used for the modification and cutting process of memory products.
Equipment Advantages
  • 01
    Equipped with high-precision linear motors and a high-speed X-Y motion platform
  • 02
    [DFT Dynamic Tracking and Compensation System] Features a high-precision wafer surface height tracking and compensation system to ensure processing stability
  • 03
    [SLM Laser Modulation Technology] Equipped with light spot shaping and compensation functions to improve laser utilization efficiency and product cutting quality
  • 04
    The operating software is simple and user-friendly, and the equipment is easy to maintain; 5.Minimal laser sputtering (SPLASH ＜10μm)
  • 05
    Dual-beam (2-Beam) simultaneous processing for high efficiency
  • 06
    Fab-grade transfer robot, compatible with different cassettes such as FOSB and FOUP specifications
Equipment Picture
Wafer Handling Laser Stealth Dicing Equipment
Basic Parameters
  • 1. Applicable Products：8/12 inch semiconductor wafers
  • 2. Laser Source：Infrared laser (Different infrared lasers are matched according to different products)
  • 3. Cutting Speed：0-1000mm/s
  • 4. Operation Mode：Fully automatic
  • 5. Shaping and Compensation System：SLM
  • 6. Product Surface Tracking System：DFT Dynamic Tracking and Compensation System